News tagged with memory footprint
TSMC Unveils First Commercial 65-Nanometer Multi-Time Programmable Non-Volatile Memory Technology
Jul 02, 2009 |
5 / 5 (1) |
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Taiwan Semiconductor Manufacturing Company today announced the foundry segment’s first functional 65-nanometer multi-time programmable (MTP) non-volatile memory (NVM) process technology.
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Mankind using Earth's resources at alarming rate
Nov 24, 2009 |
3.5 / 5 (22) |
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Humanity would need five Earths to produce the resources needed if everyone lived as profligately as Americans, according to a report issued Tuesday.
SanDisk, Toshiba Develop 32-nanometer NAND Flash Technology
Feb 11, 2009 |
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SanDisk and Toshiba today announced the co-development of multi-level cell (MLC) NAND flash memory using 32-nanometer process technology to produce a 32-gigabit (Gb) 3-bits-per-cell (X3) memory chip. The breakthrough ...
Memories of the way they used to be
Sep 18, 2009 |
4.3 / 5 (7) |
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A team of researchers from the University of California, San Diego School of Medicine and the Salk Institute for Biological Studies in La Jolla have developed a safe strategy for reprogramming cells to a pluripotent ...
Does carbon labelling give developing countries a bad deal?
Nov 24, 2009 |
1 / 5 (2) |
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Carbon labelling could unfairly disadvantage economies in the developing world, and mislead consumers, according to an interdisciplinary project carried out by the UK Research Councils' Rural Economy and Land Use Programme. ...
Portable 3-D laser technology preserves Texas dinosaur's rare footprint
Other Sciences / Archaeology & Fossils
Nov 04, 2009 |
not rated yet |
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Using portable 3D laser technology, scientists have electronically preserved a rare 110 million-year-old fossilized dinosaur footprint that was previously excavated and built into the wall of a bandstand at a Texas courthouse ...
Study says dogs have larger carbon footprint than SUV
Nov 04, 2009 |
2.3 / 5 (10) |
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Thanks for killing the planet, dog owners. Well, that's a rough paraphrase of a New Zealand study that claims a medium-size dog leaves a larger ecological footprint than an SUV.
Samsung Develops New, Highly Efficient Stacking Process for DRAM
Apr 23, 2007 |
4.6 / 5 (8) |
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Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, ...
Samsung Electronics Develops New, Highly Efficient Stacking Process for DRAM
Apr 26, 2007 |
4.4 / 5 (15) |
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Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, ...
Samsung Develops 3D Memory Package that Greatly Improves Performance Using Less Space
Apr 13, 2006 |
4.3 / 5 (6) |
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Samsung Electronics announced today that it has developed a small-footprint, wafer-level processed stack package (WSP) of high density memory chips using 'through silicon via' (TSV) interconnection technology. WSP actually ...
Intel Reports Breakthrough in Stacked, Cross Point Phase Change Memory Technology
Oct 29, 2009 |
3.9 / 5 (11) |
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Intel Corp. and Numonyx today announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today's various memory types.
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