News tagged with wafer bonding
Slimmer Nanorods Good Fit for Next-Gen 3-D Computer Chips
Mar 17, 2009 |
4.7 / 5 (6) |
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Researchers at Rensselaer Polytechnic Institute have developed a new technique for growing slimmer copper nanorods, a key step for advancing integrated 3-D chip technology.
Search results for wafer bonding
Ultrathin light-emitting diodes create new classes of lighting and display systems
Aug 20, 2009 |
4.8 / 5 (11) |
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(PhysOrg.com) -- A new process for creating ultrathin, ultrasmall inorganic light-emitting diodes (LEDs) and assembling them into large arrays offers new classes of lighting and display systems with interesting ...
Sandwich technique eases 3D optical chip fabrication
Nov 29, 2007 |
5 / 5 (3) |
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Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European research consortium. ...
Microscopic gyroscopes, the key for motion sensing
Dec 09, 2009 |
5 / 5 (6) |
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(PhysOrg.com) -- Tiny devices made possible by combining the latest advances in mechanical and electronics technology could be at the heart of next-generation personal navigation and vehicle stabilisation ...
Samsung Develops New, Highly Efficient Stacking Process for DRAM
Apr 23, 2007 |
4.6 / 5 (8) |
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Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, ...
Samsung Electronics Develops New, Highly Efficient Stacking Process for DRAM
Apr 26, 2007 |
4.4 / 5 (15) |
0
Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, ...
Hitachi, Renesas Develop Technology to Enable Interconnection of Stacked Chips at Room Temperature
Jun 02, 2005 |
1 / 5 (1) |
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The new technology enables a room-temperature bonding of 10 stacked chip layers in a package with a thickness of 1 mm or less Hitachi, Ltd. and Renesas Technology Corp. today announced a new stacked chip te ...
Gene associated with pair-bonding in animals has similar effects in human males
Sep 02, 2008 |
3.6 / 5 (19) |
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Variation in the gene for one of the receptors for the hormone vasopressin appears to be associated with how human males bond with their partners, according to an international team of researchers.
Using Nanotubes in Computer Chips
Nanotechnology / Nanomaterials
Sep 10, 2009 |
5 / 5 (3) |
3
(PhysOrg.com) -- MIT materials scientists have developed a new technique for growing carbon nanotubes that could replace the vertical wires in chips, permitting denser packing of circuits.
Tiny protein provokes healthy bonding between cells
Biology /
Nov 25, 2008 |
3 / 5 (2) |
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In human relationships, a certain "spark" often governs whether we prefer one person to another, and critical first impressions can occur within seconds. A team lead by Johns Hopkins researchers has found that cell-to-cell ...
A delicate grip
Nov 04, 2009 |
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(PhysOrg.com) -- Solar wafers for use in the production of photovoltaic systems are extremely sensitive. In a test and demonstration center research is being conducted on grippers to determine the best way ...
List of search results for wafer bonding
