Semiconductors news

New 'finFETs' promising for smaller transistors, more powerful chips

Technology / Semiconductors

Nov 10, 2009 | 4.8 / 5 (13) | 3

(PhysOrg.com) -- Purdue University researchers are making progress in developing a new type of transistor that uses a finlike structure instead of the conventional flat design, possibly enabling engineers ...

Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package

Technology / Semiconductors

Nov 05, 2009 | 5 / 5 (2) | 0

Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...

NXP Sets New Benchmarks for LED Drivers

Technology / Semiconductors

Nov 05, 2009 | 4 / 5 (1) | 0

NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the ...

ARM Announces 45nm SOI Test Chip Results That Demonstrate 40 Percent Power Savings Over Bulk Process

Technology / Semiconductors

Oct 08, 2009 | 3 / 5 (1) | 2

ARM announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing ...

Cooperative design shaves chip-making costs -- a boost for Europe's bottom line

Technology / Semiconductors

Oct 06, 2009 | 4.2 / 5 (5) | 0

(PhysOrg.com) -- A European-sponsored programme that gives universities inexpensive access to state-of-the-art microchip design tools and fabrication techniques, and helps even small businesses fabricate novel ...

Filming photons, one million times a second

Technology / Semiconductors

Oct 05, 2009 | 4.7 / 5 (9) | 0

(PhysOrg.com) -- European researchers have created a CMOS (semiconductor) camera capable of filming individual photons one million times a second. The breakthrough will impact on all the most advanced areas ...

Fujitsu Develops Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset

Technology / Semiconductors

Sep 30, 2009 | 3 / 5 (1) | 1

Fujitsu announced today the development of the world's first gallium-nitride HEMT-based transceiver amplifier chipset for broadband wireless transmission equipment operating in the millimeter bandwidth, the ...

Elpida Unveils Industry's First 2-Gigabit DDR2 Mobile RAM

Technology / Semiconductors

Sep 29, 2009 | not rated yet | 0

Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed the industry's first 2-gigabit DDR2 Mobile RAM.

Moore's Law Marches on at Intel

Technology / Semiconductors

Sep 22, 2009 | 4.3 / 5 (30) | 10

Intel President and CEO Paul Otellini today displayed a silicon wafer containing the world's first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as ...

IMEC unveils promising mechanically-stacked GaAs/Ge multijunction solar cell

Technology / Semiconductors

Sep 22, 2009 | 3 / 5 (2) | 0

At the European Photovoltaic Solar Energy Conference (Hamburg, Germany), IMEC presents a mechanically-stacked GaAs/Ge multijunction solar cell. This is the first promising demonstrator of IMEC’s novel technology ...

IMEC presents large area solar cells with 18.4% conversion efficiency, featuring Cu-plated contacts

Technology / Semiconductors

Sep 22, 2009 | 4 / 5 (4) | 0

At the European Photovoltaic Solar Energy Conference (Hamburg, Germany), IMEC presents a large-area solar with a conversion efficiency of 18.4%.

Sharp's New Semiconductor Laser for Triple- and Quadruple- Layer Blu-ray Discs

Technology / Semiconductors

Sep 18, 2009 | 4.7 / 5 (11) | 5

(PhysOrg.com) -- Sharp Corporation has announced the development of a new 500 mW semiconductor laser for triple- and quadruple- layer Blu-ray discs.

Two chips in one: Researchers combine microprocessor materials

Technology / Semiconductors

Sep 16, 2009 | 5 / 5 (10) | 1

(PhysOrg.com) -- An MIT team led by Tomás Palacios, assistant professor in the Department of Electrical Engineering and Computer Science, has succeeded in combining two semiconductor materials, silicon ...

Taiwan's chip makers still face dangers: analysts

Technology / Semiconductors

Sep 16, 2009 | 4.7 / 5 (3) | 0

Taiwan's chip makers, powerful drivers of growth on the island, may have survived their worst crisis ever, but lacklustre sales and new rivals still make these risky times.

Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM

Technology / Semiconductors

Aug 31, 2009 | 4.8 / 5 (4) | 0

Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.

Semiconductor revenue forecast to fall 17 pct

Technology / Semiconductors

Aug 26, 2009 | 5 / 5 (1) | 0

Worldwide semiconductor revenue is expected to decline 17.1 percent this year compared with last year, market research firm Gartner said Wednesday.

TSMC Achieves 28nm SRAM Yield Breakthrough

Technology / Semiconductors

Aug 24, 2009 | 5 / 5 (2) | 0

Taiwan Semiconductor Manufacturing Company has become the first foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to achieve it across all three 28nm nodes.

Organic electronics a two-way street, thanks to new plastic semiconductor

Technology / Semiconductors

Aug 17, 2009 | 4.9 / 5 (8) | 2

(PhysOrg.com) -- Plastic that conducts electricity holds promise for cheaper, thinner and more flexible electronics. This technology is already available in some gadgets -- the new Sony walkman that was introduced ...