Semiconductors news
Selling chip makers on optical computing
Nov 24, 2009 |
4.6 / 5 (11) |
1
(PhysOrg.com) -- Computer chips that transmit data with light instead of electricity consume much less power than conventional chips, but so far, they've remained laboratory curiosities. Professors Vladimir ...
Fujitsu Develops Technology for Low-Temperature Full-Service Direct Formation of Graphene Transistors on Large-Scale Sub
Nov 27, 2009 |
5 / 5 (20) |
4
Fujitsu Laboratories today announced, as a world first, the development of a novel technology for forming graphene transistors directly on the entire surface of large-scale insulating substrates at low temperatures ...
Glasgow scientists predict the unpredictable to guide future nano-chip design
Nov 29, 2009 |
4.8 / 5 (4) |
0
Scientists at the University of Glasgow, in collaboration with colleagues from Edinburgh, Manchester, Southampton and York universities, have developed technology which will help microchip designers create ...
New 'finFETs' promising for smaller transistors, more powerful chips
Nov 10, 2009 |
4.9 / 5 (14) |
3
(PhysOrg.com) -- Purdue University researchers are making progress in developing a new type of transistor that uses a finlike structure instead of the conventional flat design, possibly enabling engineers ...
Semiconductor giant Infineon upgrades outlook
Nov 19, 2009 |
3.3 / 5 (3) |
0
German semi-conductor maker Infineon on Thursday upgraded its turnover and profits forecast over the next 12 months because of higher demand from the auto industry and cost cuts.
Toshiba develops molecular photoresist technology for EUV lithography
Nov 17, 2009 |
2 / 5 (16) |
1
Toshiba Corporation today announced that it has developed a high resolution photoresist (photo-sensitive film) essential for future application of EUV (extreme ultraviolet) lithography in semiconductor fabrication, ...
Elpida Completes Development of 1-Gigabit GDDR5
Nov 20, 2009 |
5 / 5 (1) |
0
Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory, today announced that it had developed a 1-gigabit GDDR5 (product name: EDW1032BABG) that operates at a world-class high speed ...
Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Nov 05, 2009 |
5 / 5 (2) |
0
Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...
NXP Sets New Benchmarks for LED Drivers
Nov 05, 2009 |
4 / 5 (1) |
0
NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the ...
- Pages: 1
