Semiconductors news
New 'finFETs' promising for smaller transistors, more powerful chips
Nov 10, 2009 |
4.8 / 5 (13) |
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(PhysOrg.com) -- Purdue University researchers are making progress in developing a new type of transistor that uses a finlike structure instead of the conventional flat design, possibly enabling engineers ...
Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Nov 05, 2009 |
5 / 5 (2) |
0
Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...
NXP Sets New Benchmarks for LED Drivers
Nov 05, 2009 |
4 / 5 (1) |
0
NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the ...
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